Description

The Professional Manual PCB Gold Plating and Electroplating Tank Station is engineered to provide precise, controllable gold deposition for printed circuit boards and electronic components requiring high electrical conductivity and corrosion resistance. Featuring a multi-tank modular workstation design, operators can manually guide PCBs through pre-cleaning, acid activation, nickel under-plating (acting as a diffusion barrier), and final gold electrodeposition steps. The system incorporates a digital DC power rectifier for exact amperage control, ensuring uniform thickness of hard or soft gold on PCB fingers and contact pads. Built with corrosion-proof polypropylene tanks and equipped with digital heating and agitation controls, this manual plating station ensures reliable, repeatable performance in prototyping labs and small-scale manufacturing units.