Deployed in metal finishing and sheet metal workshops for removing sharp burrs from stainless steel, aluminum, and copper panels.
Applied in pre-treatment lines prior to dry-film photoresist lamination, solder mask coating, and copper electroplating.
Integrated into double-sided and multilayer circuit board production lines for inner-layer copper surface conditioning.
Utilized in lead-frame preparation and flexible printed circuit (FPC) mechanical cleaning.
Fitted into electronic component manufacturing units requiring precise surface oxide layer removal.









