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Hot Air Levelling Flux

Hot Air Levelling Flux - 900, is an organic water soluble formulation that provides good coating of solder on copper and solders circuits.

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Hot Air Levelling  Flux - 900, is an organic water soluble formulation that provides good coating of solder on copper and solders circuits. Its performance under a wide range of process parameters is excellent. Flux-900 flux has  good thermal stability to be uses at solder bath temperature up to 260°C. After solder coating the flux residues are completely soluble in water fluids for hot air leveling with excellent re-flow characteristics. Thus providing PCB's with high ionic cleanliness. Available in both acidic & neutral types in various viscosity as per customer specification thus providing PCB's with high ionic cleanliness. All ingredients are bio-degradeable.

Product Application

PCB's should be cleaned with a suitable pre-cleaner to remove heavy oxides prior to fluxing, to achieve optimum soldering results. The flux can be applied by dip, roller - coating or brush.

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